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Material selection and manufacturing processes also dictate the likelihood of failure. The industry-wide shift from lead-based solder to lead-free alloys (such as SAC305) in compliance with RoHS regulations introduced new challenges. Lead-free solders are generally more brittle and have higher melting points, making them more susceptible to fracture under mechanical shock compared to their leaded predecessors. Additionally, inconsistencies in the reflow soldering profile—where the board is heated to melt the solder paste—can lead to "cold joints" or "voids" (air bubbles inside the solder), which act as stress concentrators and starting points for cracks.
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